Next to power cables, speaker cables are the most critical signal cable links in an entertainment system.
This is because speaker cables must transfer the delicate music signal while also conducting very high current into a speaker that presents a dramatically varying low-impedance load.
Shunyata has spared no expense in the design of its speaker cables’ ability to deliver high current while eliminating the multiple forms of micro-distortion that
would otherwise obscure and distort the original music signal.
Shunyata Research speaker cables start with ultra-pure OFE copper in a VTX(TM) ‘hollow tube’ geometry that maximizes power transfer while minimizing skin effect.
As you go up the series ladder, more advanced technologies become available.
Shunyata Research uses a costly sonic welding process that bonds metals at a molecular level without the use of solder, brazing rods or any other intermediary metals. This process is superior to crimping, soldering, cold soldering and cold welding. There is no better method to join conductors to terminals, which ensures maximum power transfer and a distortion free termination.
The result of these accumulated technologies is distortion-free performance rarely experienced, regardless of cost.
A L P H A S P E A K E R
Alpha speaker cables use massive 9-gauge VTX(tm) conductors and ΞTRON® technology for reference level performance. The terminals are sonic-welded ensuring minimum contact junction resistance. KPIP(tm) eliminates burn-in issues.
WIRE: OFE 9 gauge, VTX(tm) conductors
TERMINATION Standard: copper or copper/gold terminals. Optional: STIS(tm) interchangeable.
Technologies used in this cable
Second-Generation Zitron Technology
The internationally patented Zitron technology is the most compelling of Shunyata Research’s technologies given its ability to measurably lower dielectric distortion and preserve the original signal’s integrity. It requires a special type of conductor that has two signal paths and an electric field compensation circuit that creates a cancellation signal that prevents the insulation from developing a charge. Zitron cables have earned a legendary reputation among reviewers, customers, and sound professionals for their ability to eclipse the performance of even cost-prohibitive cables. Caelin Gabriel’s research has evolved to a second-generation Zitron technology that is making its debut in Alpha Series.
KPIP (Kinetic Phase Inversion Process)
Shunyata founder Caelin Gabriel developed KPIP after years of research into the underlying causes of various effects such as burn-in, wire directionality, and cryogenic treatment. He discovered an underlying core principle that burn-in and cryogenics only partially addressed. Once the governing principle was understood, it became possible to create a processing technique and machine that could virtually eliminate the need for burn-in and cryogenic treatment.
OFE 101 Copper for Unsurpassed Purity
OFE Alloy 101, or C10100, is the highest grade of copper, with a minimum 99.99% purity and a conductivity rating of 101% IACS. OFE stands for oxygen-free electrolytic and supersedes the term OFHC (oxygen-free high conductivity). C10100 is the only grade of copper that comes with a written certification of purity.
ArNi® is a type of wire created by Shunyata Research designed to be the finest quality wire available for audio purposes. It begins with the highest-purity or copper available. It is then formed in virtual hollow tubes, eliminating skin effects and eddy current distortions. And finally, the wire undergoes Shunyata’s proprietary KPIP process.
Hollow-Tube VTX Conductors: A Shunyata Exclusive
Shunyata Research’s exclusive VTX conductors are made in the shape of hollow tubes. Since current can only travel through the outer rim on the wire, no skin effects or random eddy currents occur. VTX conductors are made from pure OFE C10100 or Ohno (single-crystal) copper.
Crimping, soldering, brazing and cold soldering are all inferior methods of joining two wires or terminals together. Sonic welding uses high energy sonic waves to literally join two metals together at a molecular level. There is no solder or
intermediary metals involved in the process.